No Clean Solder Paste, Sliver Tin Soldering Paste For Electronic, PCB/Chip kit/IC/BGA/SMD Phone CPU Repairing
Solder Paste Content: Alloy Tin 62.8% Pb 36.8%Ag0.4%, Solder Flux Content: 10.8%
Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point: 183 ? (361F)
Pushing-Type Design Smoother Flowing No Wasting During Welding
Widely Used In Chip/BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance
Warning:This Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV
1.32 x 0.93 x 3.72 inches
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