Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)
Essmetuin SAC305 Solder Paste Content: Alloy Tin 96.5%Ag3%Cu0.5%, Solder Flux Content: 10.8%
Lead-Free Solder Paste -High-Temperature Solder Paste With Flux, Melting Point: 217 ? (422.6.4F)
Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
High thermal conductivity and conductivity.The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated
1.32 x 0.92 x 3.72 inches
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